http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S564648-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1979-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cde3e65f37c93bedbd274312e27deb67 |
| publicationDate | 1981-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S564648-A |
| titleOfInvention | Production of epoxy resin composition |
| abstract | PURPOSE: To obtain an epoxy resin which has a moderate curing rate and provides cured products having excellent heat resistance, by reacting an epoxy resin with a complex of an imidazole derivative and a Lewis acid or a Brϕnsted acid, and mixing the reaction product with poly-p-vinylphenol. n CONSTITUTION: A complex of an imidazole derivative and at least one acid selected from a Lewis acid and a Brϕnsted acid is prepared. Five hundredths to five pts.wt. of said complex is mixed with 100pts.wt. of an epoxy resin and the mixture is heated and reacted. Then, the reaction product is mixed with poly-p-vinylphenol or a halogenated derivative thereof so that pref. 0.5W2.0 hydroxyl eq. of the phenol is present per epoxy eq. of the reaction product. With respect to the amount of the complex added, amounts smaller than the above range can not provide cured products having desirable heat resistance, whereas amounts larger than the above range reduce moldability-improving effect and merely provide rapid curing compositions. n COPYRIGHT: (C)1981,JPO&Japio |
| priorityDate | 1979-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.