http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5623267-A

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filingDate 1979-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4149472ffaddd49797ca098b1894fcf1
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publicationDate 1981-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5623267-A
titleOfInvention Base material for improving surface characteristic
abstract PURPOSE: To obtain the base material for electroless plating having the reduction deposition control function on the surface by organic compound, etc. of which oxidation reduction potential is in a specific range and being possible to form the metallic coating having a superior adhesive strength even when an etching treatment which has hitherto been indispensable is omitted. n CONSTITUTION: Base material for electroless plating improved in the surface characteristics, is obtained by giving the reduction deposition control function by an organic compound, for example, azo compound, anthraquinone compound etc. with an oxidation reduction potential within a range of -1VW+0.5V (25°C pH=7 based on saturated calomel electric potential) and/or an atomic group composed of skeletal structure corresponding to the structure of said organic compound, on the surface of the base material composed of an optional organic or inorganic material. A metal plated body having a superior adhesive strength, etc. and composed of at least one layer of metal thin film, is formed on sais base material even when surface roughening treatment, such as ethcing, is omitted. n COPYRIGHT: (C)1981,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0718454-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02190475-A
priorityDate 1979-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.