http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S56123879-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L49-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-01
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-345
filingDate 1980-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f7aafbf5dc38f91c530b7fe588c1f69
publicationDate 1981-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S56123879-A
titleOfInvention Thick film circuit substrate
abstract PURPOSE: To flatten an organic film in the neighborhood of a slit and facilitate removal of residual resistance paste by providing a land near a region where a slit is provided on the substrate with regard to a thick film circuit substrate used for a thermal head. n CONSTITUTION: When a conductor pattern 4 is preformed on an alumina substrate 1, a land 5 of the same material as a conductor pattern 4 is formed in the external periphery of a plotted region where a slit 2 of an organic film 2 is provided. Following to this process, the organic film 2 where a slit 3 is formed, is pressureattached, this process, in turn easing an unevenness in the organic film 2 near the slit 3. Resultingly the organic film has a flat surface, so that there is no residual resisitance paste which is unnecessary when an unnecessary part is removed. Thus it is possible to form a fine pattern of a resistance. n COPYRIGHT: (C)1981,JPO&Japio
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priorityDate 1980-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.