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filingDate 1980-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9efd414682a0d0d73c5c1a84e9390c1
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publicationDate 1981-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S56122031-A
titleOfInvention Positive type photosensitive resin composition
abstract PURPOSE: To obtain a photosensitive resin composition useful as a positive type resist having superior adhesion to a substrate and slightly causing cracking by adding a copolymer of a conjugated diolefinic hydrocarbon, a monoolefinic unsatd. compound and an α,β-ethylenic unsatd. carboxylic acid together with a 1,2-quinonediazido compound. n CONSTITUTION: This photosensitive resin composition contains a copolymer of a conjugated diolefinic hydrocabon (A), a monoolefinic unsatd. compound (B) and an α,β-ethylenic unsatd. carboxylic acid (C) together with a 1,2-quinonediazido compound. As the hydrocarbon (A) 1,3-butadiene, isoprene or the like is preferably used. The quinonediazido compound may be 1,2-benzoquinonediazidosulfonic acid ester or 1,2-naphthoquinone-diazidosulfonic acid ester. n COPYRIGHT: (C)1981,JPO&Japio
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0145614-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7670745-B2
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Total number of triples: 43.