http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S56104918-A

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filingDate 1980-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_070e3ec5fc389a2549278100c9c52cbb
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publicationDate 1981-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S56104918-A
titleOfInvention Highly adhesive resin composition
abstract PURPOSE: To provide the titled compsn. which has excellent compatibility, adhesiveness to plastics and electrical characteristics, consisting of an unsaturated polyester into the backbone of which a dicyclopentadiene derivative is introduced, a vinyl monomer, a shrinkage, controlling agent and an epoxy compd. n CONSTITUTION: (a) The reaction of dicyclopentadiene (DCP) with maleic acid, (b) the reaction of DCP with maleic anhydride and water, or (c) the reaction of a hydroxylated DCP with maleic anhydride at a temp. of not higher than 150°C, gives a partially esterified DCP carboxylic acid which is then reacted with a polyhydric alcohol to obtain an unsaturated polyester. 5W30pts.wt. epoxy compd. (iv) having at least one epoxy group in the molecule is blended with 100pts.wt. of a mixt. consisting of 55W35pts.wt. above unsaturated polyester (i), 40W60pts.wt. vinyl monomer (ii) (e.g. styrene) and 4W10pts.wt. shrinkage controlling agent (iii) (e.g. PS) to obtain the desired adhesive compsn. n EFFECT: The shrinkage during curing is reduced. n COPYRIGHT: (C)1981,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9910405-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6127490-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AU-744290-B2
priorityDate 1980-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 35.