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filingDate 1979-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0d6ad938f0e3703a9c5038d1290442c
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publicationDate 1980-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S55784-A
titleOfInvention Photosensitive resin composition
abstract PURPOSE: Title composition that is composed of a specific polyamide, a monomer with photopolymerizable unsaturated bond, a photosensitizer and a thermal polymerzation inhibitor, thus reproducing images with sharp outline and giving high mechanical strength. n CONSTITUTION: To a mixture of 100wt% of a polyamide (A) from the starting material containing 10W100 mole% of a monomer bearing a basic nitrogen of formula I (R 1 , R 2 are 1W10C hydrocarbyl where they may incorporate to form ring or heterocycle; R 3 is 1W3C lower alkyl, formula II; Yis -aminopropyl) and 5W150wt% of monomer (B) bearing 2 or more photopolymerizable unsaturated double bonds, as acrylic acid, methacrylic acid, or glycidyl methacrylate, are added (C) 0.01W5wt%, based on (A) + (B), of a photosensitizer as 9,10-anthraquinone, benzophenone, and (D) 0.001W2wt% of a thermal polymerization inhibitor as hydroquinone or 2,5-diphenyl-p-benzoquinone. n COPYRIGHT: (C)1980,JPO&Japio
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