http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S555939-A

Outgoing Links

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filingDate 1978-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e60cbf5baab5245040c504028c96950d
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publicationDate 1980-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S555939-A
titleOfInvention Adhesive composition
abstract PURPOSE: An adhesive composition without requiring priming treatment of a water- absorbing inorganic substrate. in application of a surfacing material to the substrate, comprising a thermoplastic resin or a rubber emulsion, a water-soluble resin, and a chelating water-soluble resin. n CONSTITUTION: A composition comprising (A) 100 parts by wt. (solid content) of an emulsion, prepared by dispersing 25W240 parts by wt. of a thermoplastic resin, e.g. ethyline-vinyl acetate copolymer or poly acrylic resin, or a rubber, e.g. styrene-butadiene or chloroprene rubber, in 100 parts by wt. of water, (B) 0.1W20 parts by wt. of a water-soluble resin, e.g. polyvinyl alcohol or polyvinyl pyrrolidone, and (C) 0.1W20 parts by wt. of a chelating water-soluble resin, e.g. isobutylene- maleic anhydride copolymer or styrene-maleic anhydride copolymer resin. n COPYRIGHT: (C)1980,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6291576-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63265983-A
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priorityDate 1978-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 31.