| abstract |
Improved corrosion resistant, high ductility ultrasonic bonds are formed between two cubic structure metallic members such as a copper wire and a copper clad printed circuit board. Each of the members is coated, preferably by plating with a smooth layer of dead soft gold prior to bonding. The coated members are then ultrasonically bonded together. The bond formed is preferably a gold-to-gold joint with no contact between the cubic structure metallic members. This bond is unexpectedly much stronger than the dead soft gold of which it is comprised. Preferred plating and bonding parameters are discussed and analyzed. |