http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5516004-A

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filingDate 1978-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa11f960b59e73ac5d313632a772795f
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publicationDate 1980-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5516004-A
titleOfInvention Production of vinyl chloride resin molding
abstract PURPOSE: Moldings of vinyl chloride resin containing alkoxysilane is treated with low temperature plasma under specific conditions, thus producing title moldings being freed from the migration of additives as plasticizer and having improved surface and electric properties. n CONSTITUTION: A vinyl chloride resin composition comprising 100 parts by wt of vinyl chloride resin, 0.1 W 20 parts of an alkoxysilane of the formula (R 1 , R 2 are H, 1 W 4C alkyl; R 3 is H, monofunctional hydrocarbyl; a is 1 W 6; b is 0 W 2), plasticizer, stabilizer, etc., is molded. Then the moldings are set in the plasma generator and low temperature plasma is generated by passing a gas free from plasma polymerization, such as He, Ar, etc., under a pressure of 10 -3 W 10 torr and applying electric power of 13.56 MHz and 10 W 500 W between electrodes and the surface is treated for several sec W min of tens. n COPYRIGHT: (C)1980,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61243847-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3041946-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6068801-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013100549-A
priorityDate 1978-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 34.