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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
filingDate 1979-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4753c6573c661e2f4d3dc58c00062276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_227d183b69cb29c5ad13faa74334b194
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publicationDate 1980-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S55142022-A
titleOfInvention Epoxy resin composition
abstract PURPOSE: A composition that contains a reactive flexibilizer of a specific polymer as a curing agent, thus giving cured epoxy resin having high flexibility, electrical properties, high heat and water resistance. n CONSTITUTION: Preferably, a polymer obtained by the reaction of an amino-carboxylic acid such as p-aminobenzoic acid with partially hydrogenated polydienic compound, preferably obtained by hydrogenating more than 50% of polybutadiene or its copolymer in the presence of Raney catalyst or stabilized nickel catalyst and shown by the formula (R is residue of hydrogenated polydiene) is blended with an epoxy resin such as diglycidyl ether of bisphenol A to give the objective composition. Further, the addition of an amine curing agent such as 4,4'-diaminodiphenylmethane improves the heat resistance, mechanical strength, and tensile strength. n COPYRIGHT: (C)1980,JPO&Japio
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priorityDate 1979-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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