http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S55131043-A

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filingDate 1979-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_097ead4d108a1973a3d3c505527d0959
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publicationDate 1980-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S55131043-A
titleOfInvention Two-pack type underwater-curing epoxy resin composition
abstract PURPOSE:To obtain title composition which acts as a paint or an adhesive even when applied to places where the current and/or pressure of water exsist, by adding a deliquescent inorganic compound to one or both of an epoxy resin-based composition and a curing agent-based composition containing an underwater-acting curing agent. CONSTITUTION:A two-pack type underwater-curing epoxy resin composition is prepared by adding (C) a deliquescent inorganic compound to one or both of (A) a composition based on an epoxy resin or a mixture of the epoxy resin with a different resin compatible therewith and (B) a curing agent-based composition containing a curing agent capable of curing the epoxy resin placed in water. The component (A) contains other adjuvants such as fillers and a flow modifier usually in an amount of 1-300pts.wt. per 100pts.wt. of the principal resin component. As the underwater-curing agent (B), aromatic amines, polyamides, etc., which are sparingly water-soluble and replaceable with water molecules are used, and examples of the curing agent which is used in combination with the underwater-curing agent include an aliphatic polyamines, etc. As the component (C), sodium (meta) silicate, etc., are used.
priorityDate 1979-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 34.