http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5499137-A

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filingDate 1976-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7185079aa84687772c8a485afbc2cde8
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publicationDate 1979-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5499137-A
titleOfInvention Heat-resistant resin composition
abstract PURPOSE: A heat-resistant resin composition that is composed of an aromatic resin and boron nitride and has outstanding electrical and lubricating properties. n CONSTITUTION: Said composition comprises an aromatic resin bearing aromatic rings as phenyl or naphthyl groups in the molecular chains as recurring units, as polyimide, polyamideimide, polybenzimidazole, polybenzothiazole, polydiphenyl oxide, polybenzoxazole, polyimidazopyrrolone, polyesterimide, polyphenylene oxide and polymethylenephenlene oxide and boron nitride in an amount of 60 wt% based on the resin. n EFFECT: Said composition can withstand temperatures as high as over 300°C up to 400°C. n USE: Electrical insulation coating, insulator, parts required with lubricity. n COPYRIGHT: (C)1979,JPO&Japio
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priorityDate 1976-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 29.