| abstract |
1463023 Containers for semi-conductor devices BURROUGHS CORP 1 April 1975 [30 April 1974] 13312/75 Heading H1K A continuously operating I.C. 13 is enclosed by a sealed package comprising a ceramic. body 11 having a cavity 27, a layer 37 of glass on the body 11, a pattern of leads 15 on the glass layer with means for connecting these leads with the I.C. 13 in the cavity 27, means 21, 39, 46, 48, 51, 52 for sealing the cavity and means 23 fused to the body 11 for conducting heat away from the I.C. As shown, the central part of leads 15 are encased by an upper glass layer 39 which bonds a ceramic frame 46 in position leaving pads 17, 19 free for electrical connection via solder 50, 55. The heat sink 23 is bonded with a Pd/Au layer 49 and solder 53 to the ceramic body 11 and may have an extension (59) (Fig. 6, not shown) for connection to a liquid cooling arrangement. The sealing means include a ceramic frame 46 and a lid 21 of Au-plated alloy or ceramic bonded with Au/Sn alloy 52 with Au paste 51 or glass. The I.C. chip, e.g. of Si, is bonded to the cavity base 28 with Au/Si on a Au layer 31. |