| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
1997-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eddf45580eb23b479a0cceea93a98607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_367555b741d6192963ec63fca29bd089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47a0a4075223b6339d93d87caf54ab70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_977e8cf1ee4d066c40bc00c21ec30288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2429029424fbeee2bc820b2024b9e27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8dcad059a620da700c259a3bda47175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae8d3be8448da5cf24f53600672dbbbf |
| publicationDate |
1999-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H1197839-A |
| titleOfInvention |
Electronic component mounting substrate, electronic component mounting substrate, mounting method, and member to be joined to substrate |
| abstract |
(57) [Problem] To provide a high-quality high-density mounting board on which electronic components are mounted by using a lead-free metal bonding material. SOLUTION: An electronic component mounting board B and an electronic component mounting board have a joint S for joining electronic components, and the joint is formed of a metal composition containing tin and zinc, Layers 3 and 4 containing zinc substantially without tin are provided on the surface. Placing a melt of a metal composition containing tin and zinc between the electronic component and the member to be joined of the mounting board, and solidifying the melt to form a layer containing zinc substantially without tin on the surface. Have. The member to be joined P of the substrate has a side surface extending in an oblique direction with respect to the substrate and having a recess in a cross section perpendicular to the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7308756-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7455213-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001284749-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1328756-C |
| priorityDate |
1997-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |