| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34263a1d9767236ba10183da556a136b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
1997-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f662aadf3e526802f93182b460d8418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6e0381a66779fbe868d62c20b02d1bd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd75ab8856d30ba277fd945d60a2bc20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c3dc11e12a05806ad8a2cbd90d05d93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1baea9c9e4eaf0851ee201c0b33d1e3 |
| publicationDate |
1999-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H1197589-A |
| titleOfInvention |
Resin-sealed semiconductor device |
| abstract |
(57) Abstract: In a small and thin resin-sealed semiconductor device, corrosion of aluminum as an external electrode of a semiconductor chip is prevented. A resin-sealed semiconductor device in which an external electrode of a semiconductor chip is made of aluminum, the external electrode is electrically connected to a lead, and the semiconductor chip and a lead terminal connection portion are sealed with a resin material. The sealing resin material is formed by adding an ion trapping agent to a liquid sealing material made of an epoxy resin composition or a polyimide resin composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012254925-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5157911-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8066810-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008053694-A1 |
| priorityDate |
1997-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |