http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1197394-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d1d01f6fc6a8e81cf60813f0693f6cb8 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 1998-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f069478ac34356254c0744eab5eda08 |
| publicationDate | 1999-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1197394-A |
| titleOfInvention | Direct write patterning method |
| abstract | A method of forming a via in an integrated circuit device without using photolithography technology is provided. In the process of manufacturing an integrated circuit device (10), a dielectric layer (16) is provided. Is formed using a material that can be removed in an accurate and reliable manner by exposure to an energy beam (20), such as an excimer laser or an e-beam. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011023760-A |
| priorityDate | 1997-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.