| abstract |
(57) [Summary] [PROBLEMS] One-part, long shelf life, easy development with dilute aqueous alkaline solution or water, excellent solvent resistance and plating solution resistance, Provided are a resin composition and a cured product thereof, which are particularly suitable for manufacturing a printed wiring board having heat resistance to withstand temperature. A polymer having a hydroxyl group and / or a carboxyl group in a molecule (A), a (meth) acrylate compound (B), a diluent (C), a photopolymerization initiator (D), and a compound having a carbodiimide group A resin composition comprising (E). |