http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1180512-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1997-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0abfb96ada501215a6b3cc06fe28fd0 |
| publicationDate | 1999-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1180512-A |
| titleOfInvention | Epoxy resin composition and semiconductor encapsulation device |
| abstract | (57) [Summary] [PROBLEMS] Particularly excellent in moisture resistance, reflow resistance and moldability after surface mounting by IR reflow, no peeling between semiconductor chip or lead frame and generation of internal resin cracks, long-term reliability Provided are an epoxy resin composition and a semiconductor encapsulation device that can guarantee the property. (A) an epoxy resin represented by the following formula: (B) a phenolic resin represented by the following formula: (C) an epoxy resin composition comprising an inorganic filler as an essential component and the inorganic filler of (C) in a proportion of 25 to 95% by weight based on the resin composition; A semiconductor sealing device in which a semiconductor chip is sealed with a cured product. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8015725-B2 |
| priorityDate | 1997-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.