| abstract |
PROBLEM TO BE SOLVED: To produce a bump having a relatively small volume at room temperature using a relatively simple method and a relatively simple apparatus, and to produce the bump with a reduced tact time. It is an object to realize a bump forming apparatus and a bump forming method capable of improving the performance. SOLUTION: When a bump is formed by using an ultrasonic wedge bonding method, a projection 15 for forming a constriction is provided on a wire supply side of a joint portion of a wire 13 on a part of a wedge tool 11. |