http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1171508-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65G49-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-12 |
| filingDate | 1997-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed50006de0f841ff1fec15c608348534 |
| publicationDate | 1999-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1171508-A |
| titleOfInvention | Silicon wafer carrier |
| abstract | (57) [Problem] To provide a silicon wafer carrier having rigidity required for a large-sized silicon wafer carrier and uniform excellent antistatic properties on the surface of the wafer carrier. SOLUTION: (A) Thermoplastic polyester resin 100 (B) Surface resistivity of 10 8 to 10 11 Ω with respect to parts by weight (However, the surface resistivity is a measured value of the antistatic polymer at a measurement voltage of 500 V) 10 to 100 parts by weight of the antistatic polymer and (C) the fibrous conductive filler 1 having a volume resistivity of 0.1 Ωcm or less. A silicon wafer carrier molded from a polyester resin composition obtained by mixing up to 50 parts by weight. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101171526-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6344513-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001049130-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007314650-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0050514-A1 |
| priorityDate | 1997-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.