| abstract |
(57) [Problem] To provide an epoxy resin composition which can reduce high heat resistance and dielectric properties without impairing heat resistance and mechanical properties of a conventional epoxy resin composition, and a cured product using the same. An epoxy resin composition comprising (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a curing agent, and (C) a curing accelerator, wherein (A) is a methine-bonded alkyl. An epoxy resin composition containing a substituted polyfunctional epoxy resin and a compound having one or more active ester groups in one molecule as (B). Then, the composition is cured to obtain a cured product. |