http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1171444-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1997-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6732f72e4d8c7d8711a96d9c4a545bc8 |
| publicationDate | 1999-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1171444-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary] [PROBLEMS] A semiconductor package for area mounting, which has less warpage at room temperature and in a soldering process, has excellent reliability such as solder resistance and temperature cycle resistance, and has excellent moldability. An epoxy resin composition for sealing and a semiconductor device sealed with the epoxy resin composition. SOLUTION: Epoxy resins represented by the general formulas (1) and (2) are contained in the total epoxy resin in an amount of 40 to 60% by weight and a melting point of 5%. A crystalline epoxy resin at 0 to 150 ° C. is contained in the total epoxy resin in an amount of 40 to 60% by weight, and a phenol resin curing agent of the general formula (3) is contained in the total phenol resin curing agent in an amount of 80% by weight or more; An epoxy resin composition for semiconductor encapsulation comprising 80 to 85% by weight of fused silica powder in a total resin composition, and a semiconductor device encapsulated thereby. Embedded image Embedded image Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002173578-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002020460-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006117711-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001146511-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6555602-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015160893-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019080060-A |
| priorityDate | 1997-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.