| abstract |
(57) [Summary] [Constitution] A semiconductor resin paste comprising a liquid epoxy resin, a phenol curing agent, a latent curing agent, an epoxy-modified alkoxysilane coupling agent, an organic borate salt, and an inorganic filler. [Effect] It is possible to cure by both in-line curing method (hot plate curing, HP curing) and batch method (oven curing) in IC manufacturing, with sufficient adhesive strength and low stress, and long pot life. Excellent in properties, productivity. |