http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1160901-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1997-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab44d7cdaf588bd1f40228515bc4b250 |
| publicationDate | 1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1160901-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary] [PROBLEMS] A semiconductor package for area mounting, which has less warpage at room temperature and in a soldering process, has excellent reliability such as solder resistance and temperature cycle resistance, and has excellent moldability. An epoxy resin composition for sealing and a semiconductor device sealed with the epoxy resin composition. The melting point represented by the general formulas (1) to (4) is 5 An epoxy for semiconductor encapsulation comprising a crystalline epoxy resin at 0 to 150 ° C., a phenol resin curing agent containing at least 20% by weight of a phenol resin represented by the general formula (5) in the total phenol resin, a curing accelerator and a fused silica powder. A resin composition and a semiconductor device sealed with the resin composition. Embedded image Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002284961-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100739363-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102408679-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4639460-B2 |
| priorityDate | 1997-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.