| abstract |
(57) Abstract: In a solder paste comprising a solder alloy powder containing zinc and a flux, a metal having a lower ionization tendency than zinc, such as bismuth, indium, gold, Add salts such as silver and copper. According to the present invention, the progress of the intermetallic compound layer of copper-zinc is suppressed, the bonding state between solder and copper is maintained, and the bonding strength is maintained even in a state where the soldering is left under a heating atmosphere. Does not decrease. |