| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e2199e6f891127b11a29b35f208f8be |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate |
1997-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49d503f2ce7f3be6784ba73c681dad9b |
| publicationDate |
1999-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H1154854-A |
| titleOfInvention |
Printed wiring board |
| abstract |
(57) [Problem] To prevent migration of a printed wiring board having a conductive paste through hole. SOLUTION: The printed wiring board 1 has an insulating substrate 10 formed by laminating a plurality of sheets made of a phenol or epoxy resin. Surface 11 on insulating substrate 10 And conductive paste through holes 20 and 30 for electrically connecting the back surface 12 with the conductive paste. The conductive paste through hole 20 includes a through hole 21 penetrating the insulating substrate 10 and through hole lands 22 and 22 ′, and the through hole 21 is filled with a conductive paste 23 of a mixture of a metal powder and a resin. On the surface of the conductive paste 23, overcoats 24 and 24 'made of an acrylic or epoxy resin are provided. The conductive paste through hole 30 is similarly configured. A blocking hole 40 is formed between the conductive paste through holes 20 and 30 as a through hole penetrating the insulating substrate 10. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11506937-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011193430-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022202493-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010110153-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6498708-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010050165-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008518485-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010267830-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8552602-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102187548-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011155296-A |
| priorityDate |
1997-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |