| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-06 |
| filingDate |
1996-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1999-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11513533-A |
| titleOfInvention |
Electronic assembly using semi-crystalline copolymer adhesive |
| abstract |
(57) Abstract: The present invention preferably provides a first circuit pattern (1) on a first substrate (12) using a semi-crystalline copolymer adhesive composition (20), which is provided in the form of a film. A microelectronic assembly for electrically interconnecting (14) to a second circuit pattern (18) on a second substrate (16). The adhesive composition preferably contains a semicrystalline copolymer containing polyether and polyamide monomer units, a tackifier and conductive particles (22). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001164140-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017066267-A |
| priorityDate |
1995-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |