Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2883 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J153-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 |
filingDate |
1996-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1999-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H11508924-A |
titleOfInvention |
Semiconductor wafer processing adhesives and tapes |
abstract |
(57) [Summary]nA semiconductor wafer processing tape comprising a constant support and a non-pressure-sensitive adhesive layer comprising a thermoplastic elastomer block copolymer mounted on the constant support. The adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber, or a photocrosslinking agent. This tape is useful for both wafer grinding and wafer dicing applications. Also disclosed is a method for processing a semiconductor wafer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010270835-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014084434-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010141367-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002100587-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000311873-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008004836-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014037458-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4667308-B2 |
priorityDate |
1995-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |