http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1140663-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 1997-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5608899f7b94858ad9c7f7352bbaeccf |
| publicationDate | 1999-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1140663-A |
| titleOfInvention | Method of forming multilayer wiring |
| abstract | (57) [Problem] To form a highly accurate pattern due to a problem that a mask pattern is not accurately transferred to a resist film in a lithography process due to a local step and a global step of a semiconductor substrate, a problem of halation due to a material of a base, and the like. It was difficult. SOLUTION: A base 11 on which a lower wiring 21 is formed is prepared, On the other hand, first and second patterns 41 and 42 serving as a mold of the upper wiring and the connection hole are formed on the substrate 31. Next, an interlayer insulating film 51 covering them is formed of a fluid insulating material. Next, the interlayer insulating film 51 is pressed against the base 11 to bury a part thereof between the lower wirings 21, and then the interlayer insulating film 51 is cured and bonded to the base 11. Then, the substrate 31, the first and second After removing the patterns 41 and 42 of FIG. 2, a wiring groove 52 and a connection hole 53 are formed, and the interlayer insulating film 51 is further anisotropically etched until the connection hole 53 reaches the lower layer wiring 21, and then the connection hole 53 and the wiring groove An upper wiring material is embedded in the upper wiring 52 and an upper wiring 61 and a connection plug 62 are formed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000294631-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4498502-B2 |
| priorityDate | 1997-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.