http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H113965-A

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filingDate 1998-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58c55c8a433fde54e93d7037d48817a8
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publicationDate 1999-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H113965-A
titleOfInvention Semiconductor device having exposed wire leads
abstract (57) [Problem] To provide a semiconductor device in which an access surface of a chip is insulated without covering a wire lead. A semiconductor device having conductive leads (25) disposed inside a first insulating material (22) and having exposed end portions, wherein the first insulating material is insulated first and second integrated circuit chips. Disclosed are semiconductor devices interleaved between 10,16. The first insulating material is etched to form a recess, and then the second insulating material 34 is And on the access surface 30 of the second integrated circuit chip and inside the recess. Next, the tip 2 of the wire lead 5 with chemical mechanical polishing or wet etching / Exposed by either of the development steps.
priorityDate 1997-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 21.