http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H113965-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
filingDate | 1998-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58c55c8a433fde54e93d7037d48817a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc699208ce3ea0980913d17ba7073df2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a6f255445ce7536519708dff2bfc410 |
publicationDate | 1999-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H113965-A |
titleOfInvention | Semiconductor device having exposed wire leads |
abstract | (57) [Problem] To provide a semiconductor device in which an access surface of a chip is insulated without covering a wire lead. A semiconductor device having conductive leads (25) disposed inside a first insulating material (22) and having exposed end portions, wherein the first insulating material is insulated first and second integrated circuit chips. Disclosed are semiconductor devices interleaved between 10,16. The first insulating material is etched to form a recess, and then the second insulating material 34 is And on the access surface 30 of the second integrated circuit chip and inside the recess. Next, the tip 2 of the wire lead 5 with chemical mechanical polishing or wet etching / Exposed by either of the development steps. |
priorityDate | 1997-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.