http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1135659-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 1997-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c1cc11e9755df94f4dd9529e8756a3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3002ac39d6506692d59e8935992b525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0572170fdad3fd5e2ca137b601da86ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b3d09057865b2e34d2be99c3a7e0641 |
| publicationDate | 1999-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1135659-A |
| titleOfInvention | Resin composition, prepreg, printed wiring board and method for manufacturing the same |
| abstract | PROBLEM TO BE SOLVED: To provide an encapsulant and an insulating layer of a printed wiring board, which have a low moisture absorption and a low dielectric constant, which are required with the evolution of semiconductor packaging and mounting technology such as COB. A resin composition is provided. SOLUTION: An electric insulation comprising a naphthol-modified glycidyl ether type or a glycidyl ether type epoxy resin containing a biphenyl group and a curing agent having the same chemical structure except that the glycidyl ether group of the epoxy resin is replaced by a hydroxyl group. A resin composition for use, and a thermosetting resin composition containing a glycidyl ether type epoxy resin and a curing agent having the same chemical structure except that the glycidyl ether group of the epoxy resin is substituted with a hydroxyl group, to impregnate the base material. A dried prepreg, a printed wiring board using this thermoplastic resin plastic as an insulating layer, and a method of manufacturing the same. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006307227-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009242657-A |
| priorityDate | 1997-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.