http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11343346-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-26 |
| filingDate | 1998-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71dbfcd7046300b5a865ac1112893b02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_501dc835e5ff986876f9ba384da2dbf4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adb49f567d13e482aacbf732e5193541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_899ae2a979c80eb48c4dac8b003ab5ff |
| publicationDate | 1999-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11343346-A |
| titleOfInvention | Thermosetting oxetane composition, method of curing the same, and cured product obtained by the method |
| abstract | [PROBLEMS] The present invention is excellent in mechanical properties, electrical properties, adhesiveness, heat resistance, moisture resistance, chemical resistance, etc., paints, coatings, adhesives, electric insulating materials, semiconductors. Sealing material, Provided is a thermosetting oxetane composition for producing a novel cured product useful as a substitute for an epoxy resin in application fields such as civil engineering building materials, a method for curing the composition, and a novel cured product obtained by the method. I do. The present invention relates to a polymer having one oxetane ring in a side chain of a repeating structural unit, a compound having two or three thiol groups in a molecule, and optionally a quaternary onium salt. A thermosetting oxetane composition, wherein the composition is in a solvent-free state at a temperature not less than the lower of the melting point of the polymer or the melting point of the acid anhydride and not more than 300 ° C. The present invention relates to a novel cured product having a three-dimensional network structure obtained by repeatedly performing an addition reaction at a temperature of about 300 ° C. and a method for producing the same. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005044893-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7226710-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4907349-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6844130-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008208324-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7230055-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007502859-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0236660-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100454142-C |
| priorityDate | 1998-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 233.