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filingDate 1999-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11340426-A
titleOfInvention Semiconductor device and method of manufacturing semiconductor device
abstract (57) Abstract: Provided is a semiconductor device having a low connection resistance between a silicon layer and a wiring layer while maintaining the function of a ferroelectric layer, and a method for manufacturing the same. SOLUTION: A metal layer 30 made of nickel, which is a metal that is silicided at a temperature lower than a temperature at which the ferroelectric layer FL loses ferroelectricity irreversibly, is partially formed on one upper surface of a source / drain region 26. It forms so that it may contact. Thereafter, the metal layer 30 is silicided by heating at a temperature equal to or lower than the temperature at which the ferroelectric layer FL irreversibly loses ferroelectricity, thereby forming a silicide layer 31. Therefore, the portion of the metal layer 30 that is in contact with the upper surface of the N + diffusion layer 26 can be sufficiently silicided without deteriorating the function of the ferroelectric layer FL. Nickel has a very low reduction catalytic action on the ferroelectric layer FL. Therefore, the metal layer 30 that has not been silicided does not adversely affect the ferroelectric layer FL in a later step.
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