http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11340286-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-79 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-603 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1998-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc9d31ff4951b4044c9fbc114096eaad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bdc4f153eab4f8abd511f2e066bb223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42093c630f9be8e92878c77f108d786a |
| publicationDate | 1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11340286-A |
| titleOfInvention | Semiconductor mounting tool and method of manufacturing the same |
| abstract | PROBLEM TO BE SOLVED: To provide a semiconductor mounting tool which employs a hard and dense material at the tip of the tool, hardly causes chipping and cracking, has good wear resistance, and a method of manufacturing the same. Is what you do. SOLUTION: A cubic boron nitride sintered body composed of cubic boron nitride particles having a particle size of 1 μm or less is formed as a tool tip 4, and the tool tip 4 is provided in a device hole provided in a film carrier. To form a bonding surface 5 protruding to a width that does not affect the auxiliary film for reinforcing the free end of the lead wire. |
| priorityDate | 1998-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.