http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11323086-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1998-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ac1e8afc552dffb8caea38abd7de7db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e73928cbbf8b2838caf3bb4cb5f067f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_597b4f551125092134ad384f1d099624 |
| publicationDate | 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11323086-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | (57) [Summary] (Modified) [Solution] (a) Epoxy resin (b) Curing agent (c) Average composition formula (1) R 1 m R 2 n Si (OR 3 ) p (OH) q O (4-mnpq) / 2 (1) (wherein, R 1 is a phenyl group, R 2 is a monovalent hydrocarbon group or a hydrogen atom containing no aromatic ring having 1 to 6 carbon atoms, and R 3 is a monovalent hydrocarbon group having 1 to 4 carbon atoms.) Represents a hydrogen group, m, n, p, q is 0.5 ≦ m ≦ 2.0, 0 ≦ n ≦ 1.0, 0.42 ≦ p ≦ 2.5, 0 ≦ q ≦ 0.35, 0.92 ≦ m + n + p It is a number that satisfies + q ≦ 2.8. ): 0.1 to 50 parts by weight based on 100 parts by weight of the total of components (a) and (b) (d) Inorganic filler: component (a) and component (b) Total amount 1 An epoxy resin composition for semiconductor encapsulation containing 400 to 1,200 parts by weight based on 00 parts by weight. The semiconductor device sealed with the cured product of the epoxy resin composition has high flame retardancy and is highly reliable. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7648766-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7138467-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003048959-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03002662-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003012767-A |
| priorityDate | 1998-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 74.