| abstract |
(57) [Summary] [PROBLEMS] To suppress generation of voids and cracks after sealing, decrease in mechanical strength of a resin layer, decrease in adhesive strength with a silicon element, and further cut a wafer into individual elements. Provided is a sealing resin composition which is useful for manufacturing a highly reliable semiconductor device, which does not cause peeling due to an impact at the time. SOLUTION: In the resin composition for encapsulating a semiconductor device containing an epoxy resin, a curing agent and an inorganic filler, the inorganic filler contains silica containing a hydroxyl group on its surface, and the hydroxy group-containing silica contains trimethoxysilane. Is subjected to a dealcoholation reaction so that the amount of trimethoxysilane involved in the reaction is 0.05 mmol / g or more. |