| abstract |
[57] [Problem] To be excellent in heat resistance, adhesion, resolution, electroless plating resistance, electric characteristics, etc. required for a solder resist of a printed wiring board and an interlayer insulating layer of a multilayer wiring board. Particularly, a cured film excellent in moisture absorption resistance and PCT resistance required for an IC package is obtained. (A) (a) an epoxy compound having two or more epoxy groups in one molecule; and (b-1) a phenol compound represented by the following formula (1) and / or a phenol compound represented by the following formula (2): The naphthol compound shown below, or (b-2) a phenolic compound having a hydroxyl group-containing substituent, and (c) a reaction product of an unsaturated group-containing monocarboxylic acid (X) with respect to the alcoholic hydroxyl group of (d), ) A photosensitive prepolymer obtained by reacting a polybasic acid anhydride, (B) a polyfunctional unsaturated compound and / or an organic solvent which is liquid at room temperature as a diluent, (C) a photopolymerization initiator, (D) An alkali development type photocurable / thermosetting composition containing an epoxy resin and (E) a curing catalyst is provided. Embedded image |