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classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K101-12
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filingDate 1998-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e81e77c12e110c2ec59384c26fccae6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e02aaef181df7ab51042f64a5a97c721
publicationDate 1999-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11310880-A
titleOfInvention Metal-plated resin molded products
abstract (57) [Summary] [PROBLEMS] To increase the peeling strength of a plating film in plating a thermoplastic resin molded product, to provide a large molded product and excellent heat resistance, and to withstand vibration, thermal shock, and long-term use. Kind Code: A1 A metal has a structure in which metal is continuously entangled inside a base resin near an interface with a metal plating layer. In other words, the plating metal enters a continuous hole formed inside the resin surface. It is a metal-plated resin molded product forming a mutual network structure. By controlling the particle size and content of the acid-soluble inorganic filler to be mixed with the polypropylene and the etching conditions, a plating film peeling strength of 2 kg / cm or more is developed.
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