| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C29-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C32-0063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C32-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C29-06 |
| filingDate |
1999-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8cf0a09326e5d041d84b62e5f6464a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c53aae9c6864cf52d66d6598e1473e96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5684758e072556ed8719960f98f64cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_101efcf08a14ac7a825f23f4eb6daa71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7560ce022e7c909572ec510fe14ec3e9 |
| publicationDate |
1999-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11310843-A |
| titleOfInvention |
Semiconductor device member and method of manufacturing the same |
| abstract |
PROBLEM TO BE SOLVED: To provide a highly heat-conductive and lightweight alloy having good thermal expansion coefficient matching with ceramics and the like, and a net shape after burning, and particularly suitable for high power devices. -To provide an inexpensive SiC-based sintered body. SOLUTION: SiC particles are contained in Al or Al alloy. It is an Al-SiC-based composite alloy which is dispersed in 0 to 70% by weight and has a uniform composition with the same component ratio between the surface and the inside. In particular, the SiC content is 60% by weight or more, and the thermal conductivity thereof is 200 W / m · K or more at 20 ° C. This composite alloy has a thermal expansion coefficient of 150 W / m · K or more at a temperature of 00 ° C. or more and a thermal expansion coefficient of 10 × 10 −6 / ° C. or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8092914-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007299789-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7749430-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016113696-A |
| priorityDate |
1998-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |