http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11302894-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 |
| filingDate | 1998-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbd678b3bbceb2e886617138c8325cf0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd245d7a388e3d22261a8edee6d93e31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e16dfe70d84050c19b981b08264cd2e |
| publicationDate | 1999-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11302894-A |
| titleOfInvention | Electroplating method |
| abstract | (57) Abstract: When a nickel film and a tin film are continuously formed on a terminal electrode of an electronic component by electroplating, the tin film is not properly formed, and satisfactory solder wettability is obtained. There may not be. SOLUTION: Tin ions in a tin plating bath 6 may be mixed into a nickel plating bath 3 along with a holder for holding an electronic component as a plating object. It has been found that there is an adverse effect on the subsequent tin plating treatment. Therefore, the plating process is performed while always controlling the tin ion concentration in the nickel plating bath 3. In this management, it is preferable that the tin ion concentration in the nickel plating bath 3 be 500 ppm or less. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010147167-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103361687-A |
| priorityDate | 1998-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.