http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11302389-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-08
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-20
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filingDate 1998-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a208c6344af6cadae9af556dea7f224b
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publicationDate 1999-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11302389-A
titleOfInvention Method for producing granular epoxy resin composition
abstract (57) Abstract: A granular epoxy resin composition having a particle size of 0.2 to 3 mm by granulating a powder of an epoxy resin composition containing an epoxy resin, a curing agent and an inorganic filler as main components. In the production of the mixture, a rotatable mixing granulation tank is provided, and the powder charged into the inside by the rotation of the mixing granulation tank is mixed and granulated. A method for producing a granular epoxy resin composition, comprising adding a body, mixing and granulating at a temperature at which at least a part of the resin component is melted, to obtain a granulated product having a particle size of 0.2 to 3 mm. Method. According to the present invention, a process for simplifying a granular epoxy resin composition that prevents the working environment from being deteriorated due to dust when sealing a semiconductor device and does not generate external voids or internal voids. Therefore, it can be produced industrially with great cost merit.
priorityDate 1998-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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