http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11298140-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
filingDate | 1998-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bd37688c8e2697331635eeac825f0f4 |
publicationDate | 1999-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H11298140-A |
titleOfInvention | Method and apparatus for manufacturing wiring board |
abstract | (57) [Problem] In a method and an apparatus for manufacturing a wiring board such as a printed wiring board, wiring accuracy is within a substrate plane, and accuracy is not guaranteed in an interlayer perpendicular to the substrate and in a lamination direction. . A method (apparatus) for manufacturing a wiring board includes a positioning step (part) for positioning a substrate, a processing step (part) for processing wiring, and a measurement step (part) for measuring a positional deviation of wiring. A series of steps are used as components, and the wiring position data obtained in the measurement step is fed back to the positioning step (part) and processing step (part), and the step of resetting the positioning and processing conditions (mechanism) is performed between steps. It was constituted to have. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007261213-A |
priorityDate | 1998-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.