http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11298140-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20
filingDate 1998-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bd37688c8e2697331635eeac825f0f4
publicationDate 1999-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11298140-A
titleOfInvention Method and apparatus for manufacturing wiring board
abstract (57) [Problem] In a method and an apparatus for manufacturing a wiring board such as a printed wiring board, wiring accuracy is within a substrate plane, and accuracy is not guaranteed in an interlayer perpendicular to the substrate and in a lamination direction. . A method (apparatus) for manufacturing a wiring board includes a positioning step (part) for positioning a substrate, a processing step (part) for processing wiring, and a measurement step (part) for measuring a positional deviation of wiring. A series of steps are used as components, and the wiring position data obtained in the measurement step is fed back to the positioning step (part) and processing step (part), and the step of resetting the positioning and processing conditions (mechanism) is performed between steps. It was constituted to have.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007261213-A
priorityDate 1998-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 18.