patent/JP-H11297735-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11297735-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	1998-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8da2c02c2d7f537253946ec75a8b9eaf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6749974096ef87d778ab821de8ee828c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e29ff0d5e3c64a8a34bc78bb7a580a24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0cc4afdc41b25aded202e19e6bc777c
publicationDate	1999-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-H11297735-A
titleOfInvention	Bump manufacturing method and semiconductor device
abstract	(57) Abstract: An object of the present invention is to realize a bump manufacturing method and a semiconductor device with improved bump manufacturing yield. SOLUTION: A forming step of forming a bump on a dummy wafer, a dicing step of dicing the dummy wafer to form a dummy chip, an inspection step of inspecting a bump formed on the dummy wafer, and the inspection step of the dummy chip The method is configured to include a transfer step of transferring the bumps of the dummy chip, which has passed the above, to the actual chip on which the circuit is formed.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018085476-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8609444-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010226086-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020136414-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005101468-A
priorityDate	1998-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID154497375 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID433323336 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727

Total number of triples: 34.