| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00d9474213f1cfc11cef22681cf0f69a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate |
1998-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_104de4c239801aef9b99050776795b1e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c52c5360b5a49cb6f62f5a46ede6f520
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca700e0cae97c098ce7c2b2ba71b5a83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4927beb18d876623e0144a3a7c3bc583 |
| publicationDate |
1999-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11295890-A |
| titleOfInvention |
Photoresist composition and flexible printed wiring board with protective layer |
| abstract |
PROBLEM TO BE SOLVED: To provide a suitable photoresist composition for etching a protective layer comprising a polyimide layer formed on a flexible wiring board. A photoresist composition for etching a polyimide precursor layer formed on a conductive circuit, wherein the photoresist composition is a photopolymerizable oligomer (A), a water-soluble resin (B). ) And an amino group-containing resin (C), and the amino layer-containing resin (C) enhances adhesion to the polyimide precursor layer, thereby preventing the photoresist layer from peeling off in the etching process. |
| priorityDate |
1998-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |