http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11293193-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D207-448 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 1998-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3156a51f8a6c868a372db5f71d4c78f2 |
| publicationDate | 1999-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11293193-A |
| titleOfInvention | Flexible printed circuit board |
| abstract | PROBLEM TO BE SOLVED: To provide a highly reliable flexible printed circuit board using a maleimide resin adhesive having flexibility, heat resistance, and mechanical strength. SOLUTION: After mixing a maleic acid analog powder represented by the general formula (1) and a diamine powder in a solid state so that the molar ratio becomes 1: 1, the mixture is kept in a solid state. A maleimide-based resin solution obtained by dissolving a maleimide-based resin containing a repeating unit represented by the general formula (2) in a polar solvent, which is obtained by heat treatment at a temperature of 200 ° C., is applied to a heat-resistant resin film. After heating and drying, After thermocompression bonding with a conductor foil, or coating and heating and drying on a conductor foil, thermocompression bonding with a heat-resistant resin film is performed. Embedded image Embedded image In the formulas (1) and (2), R 1 and R 2 each represent hydrogen, an alkyl group, a phenyl group, or a substituted phenyl group; r represents a divalent aromatic organic group. |
| priorityDate | 1998-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.