http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11293088-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
filingDate 1998-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23
publicationDate 1999-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11293088-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which is excellent in solder resistance, hardenability, low warpage, and moldability, particularly semiconductor encapsulation suitable for BGA, and using the same. To provide a semiconductor device. SOLUTION: A stilbene type epoxy resin represented by the general formula (1) and / or a triphenolmethane type epoxy resin represented by the general formula (2), a phenol / benzaldehyde resin represented by the general formula (3), and curing acceleration An epoxy resin composition for semiconductor encapsulation comprising, as essential components, an agent and an inorganic filler contained in an amount of 73% by weight or more in the entire epoxy resin composition. Embedded image (In the formula, R 1 to R 8 represent a hydrogen atom, a methyl group, or a tertiary butyl group, and may be the same or different from each other.) (In the formula, k represents 0, 1 or 2, and may be the same or different. M ≧ 1. R 9 to R 9 11 represents a chain or cyclic alkyl group having 1 to 6 carbon atoms, which may be the same or different from each other. ) (Where n ≧ 1)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002053643-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001192435-A
priorityDate 1998-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419531457
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226393570
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412798128
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458392451
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID160408814
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523655
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777387
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID996
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393345
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID240
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21982728
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456171974
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425042019
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452039382
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393636
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425334797
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID638088
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83648
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID335
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8934
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID164912
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393640
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226571252
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474448

Total number of triples: 40.