http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11293088-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
filingDate | 1998-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
publicationDate | 1999-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H11293088-A |
titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which is excellent in solder resistance, hardenability, low warpage, and moldability, particularly semiconductor encapsulation suitable for BGA, and using the same. To provide a semiconductor device. SOLUTION: A stilbene type epoxy resin represented by the general formula (1) and / or a triphenolmethane type epoxy resin represented by the general formula (2), a phenol / benzaldehyde resin represented by the general formula (3), and curing acceleration An epoxy resin composition for semiconductor encapsulation comprising, as essential components, an agent and an inorganic filler contained in an amount of 73% by weight or more in the entire epoxy resin composition. Embedded image (In the formula, R 1 to R 8 represent a hydrogen atom, a methyl group, or a tertiary butyl group, and may be the same or different from each other.) (In the formula, k represents 0, 1 or 2, and may be the same or different. M ≧ 1. R 9 to R 9 11 represents a chain or cyclic alkyl group having 1 to 6 carbon atoms, which may be the same or different from each other. ) (Where n ≧ 1) |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002053643-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001192435-A |
priorityDate | 1998-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.