http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11288972-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 1998-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a5b7f0e52066114ce8a24b4d555b34d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6067b0bb69604ac7b27d222adb57edf1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 |
| publicationDate | 1999-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11288972-A |
| titleOfInvention | Semiconductor plastic package |
| abstract | (57) [Summary] [PROBLEMS] To obtain a semiconductor plastic package excellent in heat dissipation, heat resistance after moisture absorption, and the like. A semiconductor plastic package of a ball grid array using a metal-core printed wiring board, wherein a part of the metal core has a plurality of convex portions in a part of a surface in the shape of a truncated cone. A heat conductive adhesive or solder is attached to the semiconductor chip, and when this is laminated under heat and pressure, the connection is good by bonding to the backside of the semiconductor chip mounting metal foil, and the semiconductor chip fixed on this, The surrounding circuit conductors are connected by wire bonding, the front and back circuits are connected by through-hole conductors insulated with thermosetting resin, and one or more through-holes are directly connected to the metal plate. Is a resin-sealed semiconductor plastic package. [Effect] A semiconductor plastic package having a novel structure that is excellent in heat dissipation and heat resistance after moisture absorption, and is suitable for mass productivity can be obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002118204-A |
| priorityDate | 1998-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.