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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D13-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-60
filingDate 1998-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cc14bef459228af7cf6b849fad51f69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74879ca17b7dbe6daa3a76227a8dc324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d897d3cbed22f4bd8c65f0cacaf128ce
publicationDate 1999-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11277548-A
titleOfInvention Resin molding die, releasable polymer electrodeposition coating composition and coating film forming method
abstract (57) [Summary] [Problem] A mold structure of a microstructure has good mold release property, Provided are a mold having a thin film and a highly flat coating film, a releasable polymer electrodeposition coating composition, and a coating film forming method. (1) An electrodeposition coating is formed by using an electrodeposition polymer, a neutralizing agent, a solvent, water, and a release polymer electrodeposition paint containing release particles. 10 μm thick coating The mold that is below. (2) In a release polymer electrodeposition coating composition containing an electrodeposition polymer, a neutralizing agent, a solvent, water and release particles, a specific electrodeposition polymer or the like and release particles are used. Has an average particle size of 5. A release polymer electrodeposition coating composition having a particle size of 0 μm or less. (3) A method for forming a releasable coating film, which is formed by electrodeposition coating a conductive mold for molding the release polymer electrodeposition coating composition according to (2). . (4) Electrodepositing a mold having conductivity for forming the release polymer electrodeposition coating composition according to (2) above, A molding method for molding a molded object in a mold.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013056961-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008260844-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4684466-B2
priorityDate 1998-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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