http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11274698-A

Outgoing Links

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filingDate 1998-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a148b4a349254237de031bd41ed99ff0
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publicationDate 1999-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11274698-A
titleOfInvention Manufacturing method of printed wiring board
abstract (57) [Problem] To provide a method of manufacturing a printed wiring board capable of manufacturing a solder resist layer of a high-density substrate with high precision at low cost and with a short lead time. A method of manufacturing a printed wiring board including at least an insulating base (31) and a conductor layer (32), comprising: forming a material layer (35) of a solder resist layer on the printed wiring board; Irradiating the solder resist material layer 35 with the laser beam 37 according to the above.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023181961-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012147855-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012147855-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103503582-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9204528-B2
priorityDate 1998-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Incoming Links

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Total number of triples: 24.