| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1998-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_338484a1f31b6e4ad5ada86567ca26bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0feddaf814009ebd5fbcb5fd6f892e98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27d501355788888c431dcfb0c91b41d2 |
| publicationDate |
1999-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11269346-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in moldability, reliability, and flame retardancy, and a semiconductor device using the same. An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin (B) a curing agent (C) a curing accelerator (D) red phosphorus (E) magnesium hydroxide and (F) an inorganic filler as essential components. The semiconductor element is sealed with a material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100407209-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100497065-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001233933-A |
| priorityDate |
1998-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |